Pie Scientific Tergeo Plasma Cleaner

The Tergeo Plasma Cleaner uses an O2 plasma to remove contaminants from sample surfaces. This tool is ideal for removing hydrocarbon contaminants from SEM samples prior to imaging, minimizing or eliminating entirely the formation of dark regions with low secondary electron yield in the electron beam scanning area during imaging. In addition to the removal of organic contamination, the plasma cleaner may also be used to turn hydrophobic surfaces of silicon wafers, PDMS, metals, plastics, polymers, and composite materials into hydrophilic surfaces.

Key features of the Tergeo Plasma Cleaner:

Continuous and pulsed plasma. The pulse ratio can be changed from 100% (continuous) to less than 1%. Tergeo plasma system not only adjusts rf power wattage by 1-watt interval, but also creates continuous and pulsed plasma. Change the plasma intensity by more than several orders of magnitude.
Automated operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in MFC, dual plasma strength sensors, automatic impedance matching.
High purity quartz chamber: Aluminum flange and thick-wall high purity quartz tube offer enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in pyrex glass.
Quartz chamber size: inner diameter:110mm; outer diameter: 120mm; depth 280mm
Sample shelf: 2mm thick high purity quartz plate
RF power: 13.56MHz high-frequency rf power supply with automatic impedance matching for in-situ plasma source. 0-75watt power range adjustable in 1-watt increments.

MORE INFORMATION

For more information about the capabilities and use of this machine, please send an e-mail.